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Background: Prior to Skylake and since Ivybridge Intel hardware has had the ability to use a MCS (Multisample Control Surface) as auxiliary data in "compression" operations on the surface. This reduces memory bandwidth. This hardware was either used for MSAA compression, or fast clear operations. On Gen8, a similar mechanism exists to allow the hiz buffer to be sampled from, and therefore this feature is sometimes referred to more generally as "AUX buffers". Skylake adds the ability to have the display engine directly source compressed surfaces on top of the ability to sample from them. Inference dictates that enabling this display features adds a restriction to the formats which could actually be compressed. This is backed up by a blurb in the AUX_CCS_D section from the RENDER_SURFACE_STATE: "In addition, if the surface is bound to the sampling engine, Surface Format must be supported for Render Target Compression for surfaces bound to the sampling engine." The current set of surfaces seems to be a subset as compared to previous gens (see the next patch). Also, if I had to guess I would guess that future gens add support for more surface formats. To make handling this a bit easier to read, and more future proof, the support for this is moved into the surface formats table. Along with the modifications to the table, a helper function is also provided to determine if a surface is CCS_E compatible. Because fast clears are currently disabled on SKL, we can plumb the helper all the way through here, and not actually have anything break. v2: - rename ccs to ccs_e; Requested-by: Chad - rename lossless_compression to lossless_compression Requested-by: Chad - change meaning of brw_losslessly_compressible_format Requested-by: Chad - related changes to the code to reflect this. - remove excess ccs (Chad) v3: - Commit message changes (Topi) - Const some things which could be const (Topi) Requested-by: Chad Versace <chad.versace@intel.com> Requested-by: Neil Roberts <neil@linux.intel.com> Signed-off-by: Ben Widawsky <benjamin.widawsky@intel.com> Reviewed-by: Topi Pohjolainen <topi.pohjolainen@intel.com> Reviewed-by: Chad Versace <chad.versace@intel.com> |
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File: docs/README.WIN32 Last updated: 21 June 2013 Quick Start ----- ----- Windows drivers are build with SCons. Makefiles or Visual Studio projects are no longer shipped or supported. Run scons libgl-gdi to build gallium based GDI driver. This will work both with MSVS or Mingw. Windows Drivers ------- ------- At this time, only the gallium GDI driver is known to work. Source code also exists in the tree for other drivers in src/mesa/drivers/windows, but the status of this code is unknown. Recipe ------ Building on windows requires several open-source packages. These are steps that work as of this writing. - install python 2.7 - install scons (latest) - install mingw, flex, and bison - install pywin32 from here: http://www.lfd.uci.edu/~gohlke/pythonlibs get pywin32-218.4.win-amd64-py2.7.exe - install git - download mesa from git see http://www.mesa3d.org/repository.html - run scons General ------- After building, you can copy the above DLL files to a place in your PATH such as $SystemRoot/SYSTEM32. If you don't like putting things in a system directory, place them in the same directory as the executable(s). Be careful about accidentially overwriting files of the same name in the SYSTEM32 directory. The DLL files are built so that the external entry points use the stdcall calling convention. Static LIB files are not built. The LIB files that are built with are the linker import files associated with the DLL files. The si-glu sources are used to build the GLU libs. This was done mainly to get the better tessellator code. If you have a Windows-related build problem or question, please post to the mesa-dev or mesa-users list.